Capacitive touch switch

Material：PET/Black PET

Thickness：0.125 mm--0.188mm  

Structure ：

Upper switch+spacer+Lower switch+Rear adhesive

Description：

Touch flat flexible switch

Flexible switch with keys embossed  

Flexible switch with metal domes  

Capacitive touch flexible switch

flexible circuit fabrication, also known as flex PCB fabrication, is the process of manufacturing flexible printed circuit boards (PCBs) that can bend or conform to different shapes or surfaces. These flexible circuits are widely used in various electronic devices, such as smartphones, tablets, wearable devices, and medical equipment.

The fabrication process of flexible circuits involves several stages, including design, material selection, and manufacturing. The design stage involves creating circuit layouts and defining the electrical interconnections. Specialized software such as CAD (Computer-Aided Design) is used to design the circuit layout and create a digital representation of the flexible circuit.

Once the design is complete, the material selection stage begins. Flexible circuits are typically made using a combination of flexible substrates, conductive materials, and adhesive materials. The choice of materials depends on the desired flexibility, electrical performance, and other specific requirements of the application.

The most common substrate material used in Flexible circuit fabrication is a thin and flexible plastic material, such as polyimide or polyester. These substrates offer excellent flexibility and heat resistance, making them suitable for a wide range of applications. The conductive materials used in flexible circuits are usually copper foils, which are laminated onto the substrate using an adhesive material.

After selecting the materials, the manufacturing process begins. The first step is the production of the flexible substrate. This involves coating the chosen material with a layer of copper, which serves as the conductive layer. The substrate is then patterned using a combination of etching and photolithography techniques to create the required circuit layout.

Next, the components, such as resistors, capacitors, and integrated circuits, are added to the flexible circuit. These components are typically mounted using surface mount technology (SMT) or through-hole mounting techniques. SMT involves soldering the components directly onto the surface of the flexible circuit, while through-hole mounting involves inserting the component leads into drilled holes in the substrate.

Once the components are mounted, the flexible circuit is coated with a protective layer, such as a solder mask or a conformal coating, to protect it from environmental factors, such as moisture and oxidation. This coating also helps improve the electrical performance of the circuit and enhances its durability.

The final step in the flex PCB fabrication process is testing and inspection. Various tests are performed to ensure the functionality, electrical performance, and reliability of the flexible circuit. These tests include continuity testing, insulation resistance testing, and electrical performance testing at different operating conditions. Visual inspection is also conducted to check for any manufacturing defects or damages.

In conclusion, flexible circuit fabrication is a complex process that involves designing, selecting materials, and manufacturing flexible circuits that can bend or conform to different shapes or surfaces. This process enables the production of flexible printed circuit boards that are essential in modern electronic devices. The continuous advancement in flexible circuit fabrication techniques is expected to further expand the applications of flexible circuits in the electronics industry.